About

I develop hardware for industrial imaging: camera boards including the sensor board, the interface boards a camera needs, and the redesigns that follow when a compliance test does not pass. On those boards the whole chain is mine, from requirements and architecture through component and sensor selection, schematic and layout, into bring-up, measurement, EMC, validation and production support.

That range is deliberate. Hardware that works on a bench and hardware that can be built, certified and supported are different objects, and the distance between them is where most of the engineering actually is. Working across the chain is what makes that distance visible.

Three levels

My master's thesis was integrated-circuit work — fully differential operational amplifiers for integrated RF MMIC low-pass filters in SiGe BiCMOS, using Cadence Virtuoso and CST Studio. Board and product work followed. Designing at chip level changes how you read a datasheet and how you think about what is happening inside a part rather than around it.

Across disciplines

Camera hardware is never only electronics. It meets FPGA and firmware, optics, mechanics, thermal limits, manufacturing and compliance, and the constraints arrive from all of them at once. I work with software, mechanical and production teams, and I mentor interns and junior engineers in PCB design, signal integrity and EMC validation. Before industry I spent six years as a research associate and lecturer, teaching electronics theory and practice.

Direction

AI is moving out of purely digital environments and into machines that sense and act. That transition runs through sensors, high-speed data paths, compute platforms and power architecture — the work I already do. I am building competence in Python, machine learning, computer vision, edge inference and robotics to meet it from the hardware side.

This is active learning and stated as such. It is not professional experience, and it is kept separate from the work above deliberately.